HJD-2Z-1.9G

The Multi-Mix^® HJD-Z series provides a 3 dB, hybrid junction with low insertion loss, high isolation, and high power handling in a small outline. Accurate phase and amplitude balance, make them ideal for use in PCS power amplifiers, beamforming networks, matching baluns, signal distribution and processing functions. They can also be used in monopulse receivers for processing signal feeds off the antenna.

Hybrid junctions are often used as part of more complex divider/coupler, balance mixers, image reject mixers, single sideband modulators and antenna feed network assemblies.

HJD-Z hybrid junctions are fusion bonded multilayer stripline assemblies. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventional adhesive bonding techniques.

The HJD-Z series is an easy to install SMD designed specifically for the full spectrum of wireless applications. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides excellent EM shielding.

The Multi-Mix^® HJD-Z series provides a 3 dB, hybrid junction with low insertion loss, high isolation, and high power handling in a small outline. Accurate phase and amplitude balance, make them ideal for use in PCS power amplifiers, beamforming networks, matching baluns, signal distribution and processing functions. HJD-Z series  can also be used in monopulse receivers for processing signal feeds off the antenna.

Hybrid junctions of HJD-Z series are often used as part of more complex divider/coupler, balance mixers, image reject mixers, single sideband modulators and antenna feed network assemblies.

HJD-Z hybrid junctions of HJD-Z series are fusion bonded multilayer stripline assemblies. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventional adhesive bonding techniques.

The HJD-Z series is an easy to install SMD designed specifically for the full spectrum of wireless applications. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides excellent EM shielding.