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HM64YLB36514

Features: • 2.5 V ± 5% operation and 1.5 V (VDDQ)• 16M bit density• Internal self-timed late write• Byte write control (4 byte write selects, one for each 9-bit)• Optional ×18 configuration• HSTL compatible I/O• Programmable impedance output drivers•...

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SeekIC No. : 004363584 Detail

HM64YLB36514: Features: • 2.5 V ± 5% operation and 1.5 V (VDDQ)• 16M bit density• Internal self-timed late write• Byte write control (4 byte write selects, one for each 9-bit)• Optio...

HM64YLB36514 Data Sheet

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Part Number:
HM64YLB36514
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

• 2.5 V ± 5% operation and 1.5 V (VDDQ)
• 16M bit density
• Internal self-timed late write
• Byte write control (4 byte write selects, one for each 9-bit)
• Optional ×18 configuration
• HSTL compatible I/O
• Programmable impedance output drivers
• Differential pseudo-HSTL clock inputs
• Asynchronous G output control
• Asynchronous sleep mode
• FC-BGA 119pin package with SRAM JEDEC standard pinout
• Limited set of boundary scan JTAG IEEE 1149.1 compatible
• Protocol: Single differential clock register-latch mode


Specifications

Parameter
Symbol
Rating
Unit
Notes
Input voltage on any pin
VIN
−0.5 to VDDQ + 0.5
V
1, 4
Core supply voltage
VDD
−0.5 to +3.13
V
1
Output supply voltage
VDDQ
−0.5 to +2.1
V
1, 4
Operating temperature
TOPR
0 to +85
Storage temperature
TSTG
−55 to +125
Output short-circuit current
IOUT
25
mA
Latch up current
ILI
200
mA
Package junction to top thermal resistance
J-top
6.5
/W
5
Package junction to board thermal resistance
J-board
12
/W
5



Description

The HM64YLB36514 is a synchronous fast static RAM organized as 512-kword × 36-bit. It has realized high speed access time by employing the most advanced CMOS process and high speed circuit designing technology. It is most appropriate for the application which requires high speed, high density memory and wide bit width configuration, such as cache and buffer memory in system. It is packaged in standard 119- bump BGA.

Note of HM64YLB36514: All power supply and ground pins must be connected for proper operation of the device.




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