HMC-ABH241

Features: Output IP3: +25 dBmP1dB: +17 dBmGain: 24 dBSupply Voltage: +5 V50 Ohm Matched Input/OutputDie Size: 3.2 x 1.42 x 0.1 mmApplicationThis HMC-ABH241 is ideal for:• Short Haul / High Capacity Links• Wireless LAN Bridges• Military & SpaceSpecificationsDrain Bias Voltage ...

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SeekIC No. : 004364483 Detail

HMC-ABH241: Features: Output IP3: +25 dBmP1dB: +17 dBmGain: 24 dBSupply Voltage: +5 V50 Ohm Matched Input/OutputDie Size: 3.2 x 1.42 x 0.1 mmApplicationThis HMC-ABH241 is ideal for:• Short Haul / High Cap...

floor Price/Ceiling Price

Part Number:
HMC-ABH241
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

Output IP3: +25 dBm
P1dB: +17 dBm
Gain: 24 dB
Supply Voltage: +5 V
50 Ohm Matched Input/Output
Die Size: 3.2 x 1.42 x 0.1 mm



Application

This HMC-ABH241 is ideal for:
• Short Haul / High Capacity Links
• Wireless LAN Bridges
• Military & Space



Specifications

Drain Bias Voltage                      +5.5 Vdc
Gain Bias Voltage               -1 to +0.3 Vdc
RF Input Power                              2 dBm
Storage Temperature    -65 to + 150
Chennel Temperature                   +180



Description

The HMC-ABH241 is a four stage GaAs HEMT MMIC Medium Power Amplifi er which operates between 50 and 66 GHz. The product provides 24 dB of gain, and an output power of +17 dBm at 1dB compression from a +5V supply voltage. All bond pads and the die backside are Ti/Au metallized and the amplifi er device is fully passivated for reliable operation. The HMC-ABH241 GaAs HEMT MMIC Medium Power Amplifi er is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.




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