HMC264

Features: ·Integrated LO Amplii er: -4 dBm Input·Sub-Harmonically Pumped (x2) LO·High 2LO/RF Isolation: 40 dB·Small Size: 1.32 x 0.97 x 0.1 mm·Integrated LO Amplii er: -4 dBm Input·Sub-Harmonically Pumped (x2) LO·High 2LO/RF Isolation: 40 dB·Small Size: 1.32 x 0.97 x 0.1 mmApplicationThe HMC264 is...

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HMC264 Picture
SeekIC No. : 004363795 Detail

HMC264: Features: ·Integrated LO Amplii er: -4 dBm Input·Sub-Harmonically Pumped (x2) LO·High 2LO/RF Isolation: 40 dB·Small Size: 1.32 x 0.97 x 0.1 mm·Integrated LO Amplii er: -4 dBm Input·Sub-Harmonically ...

floor Price/Ceiling Price

Part Number:
HMC264
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/3/28

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Product Details

Description



Features:

·Integrated LO Amplii er: -4 dBm Input
·Sub-Harmonically Pumped (x2) LO
·High 2LO/RF Isolation: 40 dB
·Small Size: 1.32 x 0.97 x 0.1 mm




·Integrated LO Amplii er: -4 dBm Input
·Sub-Harmonically Pumped (x2) LO
·High 2LO/RF Isolation: 40 dB
·Small Size: 1.32 x 0.97 x 0.1 mm





Application

The HMC264 is ideal for:
·Microwave Point-to-Point Radios
·LMDS
·SATCOM


The HMC264 is ideal for:
·Microwave Point-to-Point Radios
·LMDS
·SATCOM





Specifications

RF / IF Input (Vdd = +4V) +13 dBm
LO Drive (Vdd = +4V) +13 dBm
Vdd +5.5 Vdc
Storage Temperature -65 to +150
Operating Temperature -55 to +85




RF / IF Input (Vdd = +4V) +13 dBm
LO Drive (Vdd = +4V) +13 dBm
Vdd +5.5 Vdc
Storage Temperature -65 to +150
Operating Temperature -55 to +85





Description

The HMC264 chip is a sub-harmonically pumped (x2) MMIC mixer with an integrated LO amplii er which can be used as upconverter or downconverter. The chip utilizes a GaAs PHEMT technology that results in a small overall chip ea .28mm The 2LO to RF isolation is excellent eliminating the need for additional i ltering. The LO amplii er is a single bias (+3V to +4V) two stage design with only -4 dBm nominal drive requirement. All data of HMC264 is measured with the chip in a 50 ohm test i xture connected via 0.025 mm (1 mil) diameter wire bonds of minimal length <0.31 mm (<12 mils).








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