HMMC-2006

Features: • Frequency Range: DC-6 GHz• Insertion Loss: <1dB @ 6 GHz • Isolation: >70 dB @ 45 MHz>35 dB @ 6 GHz• Return Loss: >12 dB (Both Input & Output)• Switching Speed: <1 ns• P-1dB: 23 dBm @ 50 MHz >27dBm @ 6 GHz• Harmonics: <-...

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HMMC-2006 Picture
SeekIC No. : 004364712 Detail

HMMC-2006: Features: • Frequency Range: DC-6 GHz• Insertion Loss: <1dB @ 6 GHz • Isolation: >70 dB @ 45 MHz>35 dB @ 6 GHz• Return Loss: >12 dB (Both Input & Output)̶...

floor Price/Ceiling Price

Part Number:
HMMC-2006
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

• Frequency Range: DC-6 GHz
• Insertion Loss: <1dB @ 6 GHz
• Isolation: >70 dB @ 45 MHz
                 >35 dB @ 6 GHz
• Return Loss: >12 dB (Both Input & Output)
• Switching Speed: <1 ns
• P-1dB: 23 dBm @ 50 MHz
              >27dBm @ 6 GHz
• Harmonics: <-25 dBc @ 20 dBm (DC coupled)



Application

The HMMC-2006 can be used in instrumentation, communications, radar, ECM, EW, and many other systems requiring SPDT switching. It can be used for pulse modulation, port isolation, transfer switching, high-speed switching, replacement of mechanical switches, and so on. It can also be used as a terminated SPST (single-pole-single-throw) switch by placing a 50 W load on either RF output port.




Specifications

Symbol
Parameters/Conditions
Units
Min.
Max.
Vsel
Select Voltages 1 and 2
V
-12
+3
Pin
RF Input Power
dBm
30
Top
Operating Temperature
-55
+125
TSTG
Storage Temperature
-65
+165
Tmsx
Maximum Assembly Temp.
(for 60 seconds max.)
+300



Description

The HMMC-2006 is a GaAs monolithic microwave integrated circuit (MMIC) designed for low insertion loss and high isolation from DC to 6 GHz. It is intended for use as a general-purpose, singlepole, double-throw (SPDT) switch. One series and two shunt MESFETs per throw provide 1.2ÊdB maximum insertion loss and 35 dB minimum isolation at 6ÊGHz. HMMC-2006 chips use through-substrate vias to provide ground connections to the chip backside and minimize the number of wire bonds required. The device is also available in an 8-lead flatpack (1GG7-4201).




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