HMPP-389x

These ultra-miniature products represent the blending of Agilent Technologies' proven semiconductor and the latest in leadless packaging technology.

The HMPP-389x series is optimized for switching applications where low resistance at low current and low capacitance are required. The MiniPak package offers reduced parasitics when compared to conventional leaded diodes, and lower thermal resistance.

Low junction capacitance of the PIN diode chip, combined with ultra low package parasitics, mean that these products may be used at frequencies which are higher than the upper limit for conventional PIN diodes.

Note that Agilent's manufacturing techniques assure that dice packaged in pairs are taken from adjacent sites on the wafer, assuring the highest degree of match.