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HMPP-389x

Features: • Surface mount MiniPak package low height, 0.7 mm (0.028 ) max. small footprint, 1.75 mm2 (0.0028 inch2)• Better thermal conductivity for higher power dissipation• Single and dual versions• Matched diodes for consistent performance• Low capacitance•...

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SeekIC No. : 004364782 Detail

HMPP-389x: Features: • Surface mount MiniPak package low height, 0.7 mm (0.028 ) max. small footprint, 1.75 mm2 (0.0028 inch2)• Better thermal conductivity for higher power dissipation• Sin...

HMPP-389x Data Sheet

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Part Number:
HMPP-389x
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Surface mount MiniPak package
    low height, 0.7 mm (0.028") max.
    small footprint, 1.75 mm2 (0.0028 inch2)
• Better thermal conductivity for higher power dissipation
• Single and dual versions
• Matched diodes for consistent performance
• Low capacitance
• Low resistance at low current
• Low FIT (Failure in Time) rate*
• Six-sigma quality level


Application

The HMPP-389T low inductance wide band shunt switch is well suited for applications up to 6 GHz


Specifications

Symbol
Parameter
Units
Value
If
 Forward Current (1 s pulse)
Amp
1
PIV
 Peak Inverse Voltage
V
100
Tj
 Junction Temperature
150
Tstg
 Storage Temperature
-65 to +150
jc
 Thermal Resistance[2]
/W
150



Description

These ultra-miniature products like HMPP-389x represent the blending of Agilent Technologies' proven semiconductor and the latest in leadless packaging technology.

The HMPP-389x series is optimized for switching applications where low resistance at low current and low capacitance are required. The MiniPak package offers reduced parasitics when compared to conventional leaded diodes, and lower thermal resistance.

Low junction capacitance of the PIN diode chip, combined with ultra low package parasitics, mean that these products like HMPP-389x may be used at frequencies which are higher than the upper limit for conventional PIN diodes.

Note that Agilent's manufacturing techniques assure that dice of HMPP-389x packaged in pairs are taken from adjacent sites on the wafer, assuring the highest degree of match.




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