HSB276AYP

Features: · High forward current, Low capacitance.· CMPAK - 4 Package is suitable for high density surface mounting and high speed assemblyPinoutSpecifications Parameter Symbol Value Unit Repetitive peak reverse voltage VRRM 5 V Rreverse voltage VR 3 V Forward Power Dissipat...

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SeekIC No. : 004365919 Detail

HSB276AYP: Features: · High forward current, Low capacitance.· CMPAK - 4 Package is suitable for high density surface mounting and high speed assemblyPinoutSpecifications Parameter Symbol Value Unit ...

floor Price/Ceiling Price

Part Number:
HSB276AYP
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/6/15

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Product Details

Description



Features:

·  High forward current, Low capacitance.
·  CMPAK - 4 Package is suitable for high density surface mounting and high speed assembly



Pinout

  Connection Diagram


Specifications

Parameter Symbol Value Unit
Repetitive peak reverse voltage VRRM 5 V
Rreverse voltage VR 3 V
Forward Power Dissipation TA = 25 IO 30 mA
Junction Temperature TJ 125
Storage Temperature Range Tstg -55 to +125
Note: Per one device


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