HSB88WA

Features: · Low reverse current, Low capacitance.· CMPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecificationsReverse voltage VR ............................................10 VAverage rectified current IO * .........................15 mAJunction temper...

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HSB88WA Picture
SeekIC No. : 004365934 Detail

HSB88WA: Features: · Low reverse current, Low capacitance.· CMPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecificationsReverse voltage VR ...........................

floor Price/Ceiling Price

Part Number:
HSB88WA
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/5

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Product Details

Description



Features:

· Low reverse current, Low capacitance.
· CMPAK package is suitable for high density surface mounting and high speed assembly.





Pinout

  Connection Diagram




Specifications

Reverse voltage VR ............................................10 V
Average rectified current IO * .........................15 mA
Junction temperature Tj ...................................125
Storage temperature Tstg ..................-55 to +125
Note: Per one device





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