HSD16M32F4VP

Features: • Part IdentificationHSD16M32F4VP-10L• Burst mode operation• Auto & self refresh capability(4096 Cycles/64ms)• LVTTL compatible inputs and outputs• Single 3.3V ±0.3V power supply• MRS cycle with address key programs- Latency (Access from column add...

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SeekIC No. : 004365985 Detail

HSD16M32F4VP: Features: • Part IdentificationHSD16M32F4VP-10L• Burst mode operation• Auto & self refresh capability(4096 Cycles/64ms)• LVTTL compatible inputs and outputs• Single...

floor Price/Ceiling Price

Part Number:
HSD16M32F4VP
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

• Part Identification
HSD16M32F4VP-10L
• Burst mode operation
• Auto & self refresh capability
(4096 Cycles/64ms)
• LVTTL compatible inputs and outputs
• Single 3.3V ±0.3V power supply
• MRS cycle with address key programs
- Latency (Access from column address)
- Burst length (1, 2, 4, 8 & Full page)
- Data scramble (Sequential & Interleave)
• All inputs are sampled at the positive
going edge of the system clock
• 80pin-SMM type FR4-PCB design
• The used device is 2Mx16Bitx4Bankst SDRAM
• Pin assignment is compatible with
- HSD8M32F4VP
- HSD16M32F4VP
- HSD32M32F4VP





Specifications

Item Symbol Rating
Voltage on Any Pin Relative to Vss VCC -1V to 4.6V
Voltage on Vcc Supply Relative to Vss VINout -1V to 4.6V
Power Dissipation PD 4W
Storage Temperature Range Tstg -55 to 150
Short Circuit Output Current Ios 50mA
Notes:
Permanent device damage may occur if " Absolute Maximum Ratings" are exceeded. Functional operation should be
restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.





Description

The HSD16M32F4VP is a 16M x 32 bit Synchronous Dynamic RAM high density memory module. The module consists of four CMOS 2M x 16 bit with 4banks Synchronous DRAMs in TSOP-II packages is mounted on a 80-pin, single-sided, FR-4-printed circuit board., Two 0.1uF decoupling capacitors are mounted on the printed circuit board in parallel for each SDRAM. The HSD16M32F4VP is a SMM (Stackable Memory Module) designed and is intended for mounting into two 40- pin connector sockets. Synchronous design allows precise cycle control with the use of system clock. I/O transactions are possible on every clock cycle. Range of operating frequencies, programmable latencies allows the same device to be useful for a variety of high bandwidth, high performance memory system applications All module components may be powered from a single 3.3V DC power supply and all inputs and outputs are LVTTL-compatible.






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