Features: • Low forward resistance. (rf = 0.9 max)• LLD package is suitable for high density surface mounting and high speed assembly.Specifications Item Symbol Value Unit Reverse voltage VR 35 V Forward current IF 100 mA Operation temperature ...
HSK110: Features: • Low forward resistance. (rf = 0.9 max)• LLD package is suitable for high density surface mounting and high speed assembly.Specifications Item Symbol Value Unit ...
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| Item |
Symbol |
Value |
Unit |
| Reverse voltage |
VR |
35 |
V |
| Forward current |
IF |
100 |
mA |
| Operation temperature |
Topr |
-20 to + 60 |
°C |
| Storage temperature |
Tstg |
-55 to +125 |
°C |