HSK110

Features: • Low forward resistance. (rf = 0.9 max)• LLD package is suitable for high density surface mounting and high speed assembly.Specifications Item Symbol Value Unit Reverse voltage VR 35 V Forward current IF 100 mA Operation temperature ...

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HSK110 Picture
SeekIC No. : 004366121 Detail

HSK110: Features: • Low forward resistance. (rf = 0.9 max)• LLD package is suitable for high density surface mounting and high speed assembly.Specifications Item Symbol Value Unit ...

floor Price/Ceiling Price

Part Number:
HSK110
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

• Low forward resistance. (rf = 0.9 max)
• LLD package is suitable for high density surface mounting and high speed assembly.



Specifications

Item
Symbol
Value
Unit
Reverse voltage
VR
35
V
Forward current
IF
100
mA
Operation temperature
Topr
-20 to + 60
°C
Storage temperature
Tstg
-55 to +125
°C



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