HSM124S

Features: · Low reverse current.· MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Peak reverse voltage VRM 80 V Reverse voltage VR 85 V Peak forward current IFM 300 mA...

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SeekIC No. : 004366144 Detail

HSM124S: Features: · Low reverse current.· MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Peak reverse volta...

floor Price/Ceiling Price

Part Number:
HSM124S
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/17

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Product Details

Description



Features:

·  Low reverse current.
·  MPAK package is suitable for high density surface mounting and high speed assembly.



Pinout

  Connection Diagram


Specifications

Item
Symbol
Value
Unit
Peak reverse voltage
VRM
80
V
Reverse voltage
VR
85
V
Peak forward current
IFM
300
mA
Non-Repetitive peak forward surge current
IFSM*1
4
A
Average forward current
IO
100
mA
Junction temperature
Tj
125
Storage temperature
Tstg
55 to +125
Notes: 1. Within 1s forward surge current.
           2. Per one device



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