HSM226S

Features: • Low reverse current, Low capacitance.• MPAK Package is suitable for high density surface mounting and high speed assembly.Specifications Item Symbol Value Unit Repetitive peak reverse voltageNon-Repetitive peak forward surge currentforward currentJuncti...

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SeekIC No. : 004366150 Detail

HSM226S: Features: • Low reverse current, Low capacitance.• MPAK Package is suitable for high density surface mounting and high speed assembly.Specifications Item Symbol Value Uni...

floor Price/Ceiling Price

Part Number:
HSM226S
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/3/28

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Product Details

Description



Features:

• Low reverse current, Low capacitance.
• MPAK Package is suitable for high density surface mounting and high speed assembly.



Specifications

Item
Symbol
Value
Unit
Repetitive peak reverse voltage 
Non-Repetitive peak forward surge current 
forward current 
Junction temperature 
Storage temperature
VRRM
IFSM *1 *2
IF *2
Tj
Tstg
25 
200 
50 
125 
−55 to +125
V 
mA 
mA 
°C 
°C 
Notes: 1. 10 ms sine wave 1 pulse
2. Two device total



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