Features: • Small size• 0603 industry standard footprint• Diffused optics• Operating temperature range of 30˚C to +85˚C• Compatible with reflow soldering• Available in various color combination• Available in 8 mm tape on 7 (178 mm) diameter reel...
HSMF-C16x: Features: • Small size• 0603 industry standard footprint• Diffused optics• Operating temperature range of 30˚C to +85˚C• Compatible with reflow soldering̶...
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Features: • Industry Standard PLCC-4 package (Plastic Leaded Chip Carrier)• High relia...
Parameter |
AlInGaP |
InGaN |
GaP |
Units |
DC Forward Current[1] |
20 |
10 |
20 |
mA |
Power Dissipation |
48 |
35 |
52 |
mW |
Reverse Voltage |
5 |
5 |
5 |
V |
LED Junction Temperature |
95 |
95 |
95 |
˚C |
Operating Temperature Range |
30 to +85 |
˚C | ||
Storage Temperature Range |
40 to +85 |
˚C | ||
Soldering Temperature |
See reflow soldering profile (Figure 6 & 7) |
˚C |
This series of bi-color ChipLEDs HSMF-C16x is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint of 1.6 mm x 0.8 mm and a height of only 0.5 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication. They are available in a wide range of color combinations. In order to facilitate automated pick and place operation, these ChipLEDs HSMF-C16x are shipped in tape and reel, with 4000 units per reel. These parts are compatible with reflow soldering.