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MFG:HARRIS  Package Cooled:DIP/SOP  D/C:08+  

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HUF Series Datasheet download

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Part Number: HUF75307P3

 

MFG: HARRIS

Package Cooled: DIP/SOP

D/C: 08+

Description: These N-Channel power MOSFETs are manufactured using the innovative UltraFET™ process. This adva...


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HUF75307P3 General Description


These N-Channel power MOSFETs are manufactured using the innovative UltraFET™ process. This advanced process technology achieves the lowest possible on-resistance per silicon area, resulting in outstanding performance. This device is capable of withstanding high energy in the avalanche mode and the diode exhibits very low reverse recovery time and stored charge. It was designed for use in applications where power efficiency is important, such as switching regulators, switching converters, motor drivers, relay drivers, lowvoltage bus switches, and power management in portable and battery-operated products.

HUF75307P3 Maximum Ratings

 
UNITS
Drain to Source Voltage (Note 1)
VDSS
55
V
Drain to Gate Voltage (RGS = 20kW) (Note 1)
VDGR
55
V
Gate to Source Voltage
VGS
±20
V
Drain Current Continuous (Figure 2).
ID
15
A
Drain Current Pulsed Drain Current
IDM
Figure 4
Pulsed Avalanche Rating
EAS
Figures 6, 14, 15
Power Dissipation
PD
45
W
Derate Above 25
0.3
W/
Operating and Storage Temperature
TJ,TSTG
-55 to 175
Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s.
TL
300
Package Body for 10s, See Techbrief 334
Tpkg
260
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

HUF75307P3 Features

• 15A, 55V
• Simulation Models
- Temperature Compensated PSPICE® and SABER© Models
- SPICE and SABER Thermal Impedance Models Available on the WEB at: www.semi.Intersil .com/families/models.htm
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"

HUF75307P3 datasheet

HUF75307P3
PDF/DataSheet Download

  • Datasheet: HUF75307P3
  • File Size: 209703 KB
  • Manufacturer: FAIRCHILD [Fairchild Semiconductor]
  • Click here to Download

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  • ·HUF75309T3ST
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