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MFG:HARRIS  Package Cooled:DIP/SOP  D/C:08+  

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Part Number: HUF75309D3

 

MFG: HARRIS

Package Cooled: DIP/SOP

D/C: 08+

Description: These N-Channel power MOSFETs are manufactured using the innovative UltraFET™ process. This adva...


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HUF75309D3 General Description


These N-Channel power MOSFETs are manufactured using the innovative UltraFET™ process. This advanced process technology achieves the lowest possible on-resistance per silicon area, resulting in outstanding performance. This device is capable of withstanding high energy in the avalanche mode and the diode exhibits very low reverse recovery time and stored charge. It was designed for use in applications where power efficiency is important, such as switching regulators, switching converters, motor drivers, relay drivers, lowvoltage bus switches, and power management in portable and battery-operated products.

HUF75309D3 Maximum Ratings

 
UNITS
Drain to Source Voltage (Note 1)
VDSS
55
V
Drain to Gate Voltage (RGS = 20k) (Note 1)
VDGR
55
V
Gate to Source Voltage
VGS
±20
V
Drain Current Continuous (Figure 2).
ID
19
A
Drain Current Pulsed Drain Current
IDM
Figure 4
Pulsed Avalanche Rating
EAS
Figures 6, 14, 15
Power Dissipation
PD
55
W
Derate Above 25
0.37
W/
Operating and Storage Temperature
TJ,TSTG
-55 to 175
Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s.
TL
300
Package Body for 10s, See Techbrief 334
Tpkg
260
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25 to 150.

HUF75309D3 Features

• 19A, 55V
• Simulation Models
- Temperature Compensated PSPICE® and SABER© Models
- SPICE and SABER Thermal Impedance Models Available on the WEB at: www.semi.Intersil.com/families/models.htm
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"

HUF75309D3 datasheet

HUF75309D3
PDF/DataSheet Download

  • Datasheet: HUF75309D3
  • File Size: 105101 KB
  • Manufacturer: INTERSIL [Intersil Corporation]
  • Click here to Download

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