HUF75631S3ST

			HUF75631P3	UNITS
Drain to Source Voltage (Note 1)		VDSS	100	V
Drain to Gate Voltage (RGS = 20k) (Note 1)		VDGR	100	V
Gate to Source Voltage		VGS	±20	V
Drain Current Continuous (TC= 25, VGS = 10V)(Figure 2).		ID	33	A
Drain Current Continuous (TC= 100, VGS = 10V)(Figure 2).		ID	23	A
Drain Current Pulsed Drain Current		IDM	Figure 4
Pulsed Avalanche Rating		EAS	Figures 6,14,15
Power Dissipation		PD	120	W
Derate Above 25			0.80	W/
Operating and Storage Temperature		TJ,TSTG	-55 to 175
Maximum Temperature for Soldering	Leads at 0.063in (1.6mm) from Case for 10s.	TL	300
	Package Body for 10s, See Techbrief 334	Tpkg	260

CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25 to 150.