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MFG:FAIRC  Package Cooled:TO-263(D2PAK)  D/C:09+  

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Part Number: HUF75639S3S

 

MFG: FAIRC

Package Cooled: TO-263(D2PAK)

D/C: 09+

Description: These N-Channel power MOSFETs are manufactured using the innovative UltraFET™ process. This adva...


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HUF75639S3S General Description


These N-Channel power MOSFETs are manufactured using the innovative UltraFET™ process. This advanced process technology achieves the lowest possible on-resistance per silicon area, resulting in outstanding performance. This device is capable of withstanding high energy in the avalanche mode and the diode exhibits very low reverse recovery time and stored charge. It was designed for use in applications where power efficiency is important, such as switching regulators, switching converters, motor drivers, relay drivers, lowvoltage bus switches, and power management in portable and battery-operated products.

HUF75639S3S Maximum Ratings

 
 
UNITS
Drain to Source Voltage (Note 1)
VDSS
100
V
Drain to Gate Voltage (RGS = 20k) (Note 1)
VDGR
100
V
Gate to Source Voltage
VGS
±20
V
rain Current Continuous (Figure 2).
ID
56
A
Drain Current Pulsed Drain Current
IDM
Figure 4
Pulsed Avalanche Rating
EAS
Figures 6,14,15
Power Dissipation
PD
200
W
Derate Above 25
1.35
W/
Operating and Storage Temperature
TJ,TSTG
-55 to 175
Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s.
TL
300
Package Body for 10s, See Techbrief 334
Tpkg
260
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25 to 150.

HUF75639S3S Features

• 56A, 100V
• Simulation Models
- Temperature Compensated PSPICETM and SABER© Electrical Models
- Spice and Saber Thermal Impedance Models
- www.Intersil.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"

HUF75639S3S datasheet

HUF75639S3S
PDF/DataSheet Download

  • Datasheet: HUF75639S3S
  • File Size: 234839 KB
  • Manufacturer: FAIRCHILD [Fairchild Semiconductor]
  • Click here to Download

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