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MFG:F  Package Cooled:TO-220  D/C:09+  

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Part Number: HUF75645P3

 

MFG: F

Package Cooled: TO-220

D/C: 09+

 

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HUF75645P3 Maximum Ratings

 
HUF75652G3
UNITS
Drain to Source Voltage (Note 1)
VDSS
100
V
Drain to Gate Voltage (RGS = 20k) (Note 1)
VDGR
100
V
Gate to Source Voltage
VGS
±20
V
rain Current Continuous(TC= 25, VGS = 10V) (Figure 2).
ID
75
A
rain Current Continuous(TC= 100, VGS = 10V) (Figure 2).
ID
65
A
Drain Current Pulsed Drain Current
IDM
Figure 4
Pulsed Avalanche Rating
EAS
Figures 6,14,15
Power Dissipation
PD
310
W
Derate Above 25
2.07
W/
Operating and Storage Temperature
TJ,TSTG
-55 to 175
Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s.
TL
300
Package Body for 10s, See Techbrief 334
Tpkg
260
NOTES:
1. TJ = 25 to 150.
CAUTION: Stresses above those listed in "Absol24ute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

HUF75645P3 Features

• Ultra Low On-Resistance
- rDS(ON) = 0.014, VGS = 10V
• Simulation Models
- Temperature Compensated PSPICE® and SABER™ Electrical Models
- Spice and Saber Thermal Impedance Models
- www.fairchildsemi.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve

HUF75645P3 datasheet

HUF75645P3
PDF/DataSheet Download

  • Datasheet: HUF75645P3
  • File Size: 209773 KB
  • Manufacturer: INTERSIL [Intersil Corporation]
  • Click here to Download

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