Features: • 20A, 20V - rDS(ON) = 0.027Ω, VGS = 10V - rDS(ON) = 0.039Ω, VGS = 5V• PWM optimized for synchronous buck applications• Fast Switching• Low Gate Charge - Qg Total 11nC (Typ)• Low Capacitance - CISS 470pF (Typ) - CRSS 50pF (Typ)Specifications ...
HUF76009P3: Features: • 20A, 20V - rDS(ON) = 0.027Ω, VGS = 10V - rDS(ON) = 0.039Ω, VGS = 5V• PWM optimized for synchronous buck applications• Fast Switching• Low Gate Charge ...
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| SYMBOL | PARAMETER | HUF76112SK8 | UNITS |
| VDSS | Drain to Source Voltage (Note 1) | 20 | V |
| VDGR | Drain to Gate Voltage (RGS = 20kΩ) (Note 1) | 20 | V |
| VGS | Gate to Source Voltage | ±16 | V |
| ID ID IDM |
Drain Current Continuous (TA = 25, VGS = 10V) (Figure 2) Continuous (TA = 100, VGS = 5V) Pulsed Drain Current |
20 160 Figure 4 |
A A A |
| PD | Power Dissipation Derate Above 25 |
41 0.33 |
W W/ |
| TJ, TSTG | Operating and Storage Temperature | -55 to 150 | |
| TL Tpkg |
Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s Package Body for 10s, See Techbrief TB334 |
300 260 |
|
| THERMAL SPECIFICATIONS | |||
| RJA | Thermal Resistance Junction to Case, TO-220, TO-252 | 3.04 | /W |
| Thermal Resistance Junction to Case, TO-220, TO-252 | 62 | /W | |
| Thermal Resistance Junction to Case, TO-220, TO-252 | 100 | /W | |