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MFG:INTERSIL  Package Cooled:DIP/SOP  D/C:08+  

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Part Number: HUF76107P3

 

MFG: INTERSIL

Package Cooled: DIP/SOP

D/C: 08+

Description: These N-Channel power MOSFETs are manufactured using the innovative UltraFET™ process. This advanced process t...


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HUF76107P3 General Description


These N-Channel power MOSFETs are manufactured using the innovative UltraFET™ process. This advanced process technology achieves the lowest possible on-resistance per silicon area, resulting in outstanding performance. This device is capable of withstanding high energy in the avalanche mode and the diode exhibits very low reverse recovery time and stored charge. It was designed for use in applications where power efficiency is important, such as switching regulators, switching converters, motor drivers, relay drivers, low-voltage bus switches, and power management in portable and battery-operated products.

Formerly developmental type TA76107.

HUF76107P3 Maximum Ratings

Drain to Source Voltage (Note 1). . . . . . . . . . . . . VDSS 30 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . .VDGR 30 V
Gate to Source Voltage . . . . . . . . . . . . VGS ±16 V
Drain Current    
Continuous (TA= 25, VGS = 10V) (Figure 2)(Note 2). . . . ID
 20 A
Continuous (TA= 100, VGS = 5V) (Note 3) . . . . . . . . . . ID 10.5 A
Continuous (TA= 100, VGS = 4.5V)(Note 3) . . .. . . . . . ID 10 A
Pulsed Drain Current . . . . . . .. . . . . IDM Figure 4  
Pulsed Avalanche Rating. . . . . . . . . . EAS Figures 6,17,18  
Power Dissipation(Note 2) . . . . . . . . .. . . . PD
 35 W
Derate Above 25 . . . . . . . . . . . . . . . . . . 0.30 W/
Operating and Storage Temperature . . . . . . . . . . . TJ, TSTG -55 to 150
Maximum Temperature for Soldering    
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . TL 300
Package Body for 10s, See Techbrief 334. . . . . . . .Tpkg 260

HUF76107P3 Features

• Logic Level Gate Drive
• 20A, 30V
• Ultra Low On-Resistance, rDS(ON) = 0.052Ω
• Temperature Compensating PSPICE® Model
• Temperature Compensating SABER© Model
• Thermal Impedance SPICE Model
• Thermal Impedance SABER Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
        - TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"

HUF76107P3 datasheet

HUF76107P3
PDF/DataSheet Download

  • Datasheet: HUF76107P3
  • File Size: 378521 KB
  • Manufacturer: FAIRCHILD [Fairchild Semiconductor]
  • Click here to Download

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