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MFG:FAIRCHILD  Package Cooled:DIP/SOP  D/C:08+  

HUF76423S3S Product Image

HUF Series Datasheet download

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Part Number: HUF76423S3S

 

MFG: FAIRCHILD

Package Cooled: DIP/SOP

D/C: 08+

 

Urgent Purchase

HUF76423S3S Maximum Ratings

Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . VDSS 60 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) .. . . . . . . . . . . . VDGR 60 V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . VGS ±16 V
Drain Current    
Continuous (TC = 25, VGS = 5V). . . . .. . . . . ID 33 A
Continuous (TC = 25, VGS = 10V) (Figure 2) . . . . . . . . . . . . ID 35 A
Continuous (TC= 100, VGS = 5V) . . . . . . . . . . . . . . . ID 23 A
Continuous (TC= 100, VGS = 4.5V) (Figure 2) . . . . . . . . . . . ID 22 A
Pulsed Drain Current . . . . . . . . . . . . . . . . . IDM Figure 4  
Pulsed Avalanche Rating . . . . . . . . . . . . . . . UIS Figures 6, 17, 18  
Power Dissipation . . . . . . .. . . . . . PD
 85 W
Derate Above . . . . . . . . . . . . .25 0.567 W/
Operating and Storage Temperature . . . . . TJ, TSTG -55 to 175
Maximum Temperature for Soldering    
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . TL 300
Package Body for 10s, See Techbrief TB334. . . . . . . . Tpkg 260

HUF76423S3S Features

• Ultra Low On-Resistance
        - rDS(ON) = 0.030Ω, VGS = 10V
        - rDS(ON) = 0.035Ω, VGS = 5V
• Simulation Models
        - Temperature Compensated PSPICE® and SABER© Electrical Models
        - Spice and SABER© Thermal Impedance Models
        - www.Intersil.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Switching Time vs RGS Curves

HUF76423S3S datasheet

HUF76423S3S
PDF/DataSheet Download

  • Datasheet: HUF76423S3S
  • File Size: 368572 KB
  • Manufacturer: FAIRCHILD [Fairchild Semiconductor]
  • Click here to Download

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