HVC190

Features: • Low capacitance. (C = 0.35 pF max)• Low forward resistance. (rf = 3.0 typ)• Ultra small Flat Lead Package (UFP) is suitable for surface mount design.Specifications Item Symbol Value Unit Reverse voltage VR 50 V Forward current IF ...

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HVC190 Picture
SeekIC No. : 004367701 Detail

HVC190: Features: • Low capacitance. (C = 0.35 pF max)• Low forward resistance. (rf = 3.0 typ)• Ultra small Flat Lead Package (UFP) is suitable for surface mount design.Specifications ...

floor Price/Ceiling Price

Part Number:
HVC190
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/29

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Product Details

Description



Features:

• Low capacitance. (C = 0.35 pF max)
• Low forward resistance. (rf = 3.0 typ)
• Ultra small Flat Lead Package (UFP) is suitable for surface mount design.



Specifications

Item
Symbol
Value
Unit
Reverse voltage
VR
50
V
Forward current
IF
50
mA
Power dissipation
Pd*1
150
mW
Junction temperature
Tj
125
Storage temperature
Tstg
−55 to +125



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