Features: • Low capacitance.(C=0.8pF max)• Low forward resistance. (rf=1.0½ max)• MPAK package is suitable for high density surface mounting and high speed assembly.Specifications Item Symbol Value Unit Peak reverse voltage VRM 65 V Reverse...
HVM131S: Features: • Low capacitance.(C=0.8pF max)• Low forward resistance. (rf=1.0½ max)• MPAK package is suitable for high density surface mounting and high speed assembly.Specific...
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• Low capacitance.(C=0.8pF max)
• Low forward resistance. (rf=1.0½ max)
• MPAK package is suitable for high density surface mounting and high speed assembly.
|
Item |
Symbol |
Value |
Unit |
| Peak reverse voltage |
VRM |
65 |
V |
| Reverse voltage |
VR |
60 |
V |
| Peak forward current |
I F * |
100 |
mA |
| Non-Repetitive peak forward surge current |
Pd * |
150 |
mW |
| Junction temperature |
Tj |
125 |
|
| Storage temperature |
Tstg |
-55 to +125 |
* Two device total