HVM187WK

Features: · Low forward resistance. (rf = 5.5 max)· MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Reverse voltage VR 60 V Forward current IF 50 mA Power dissipation ...

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HVM187WK Picture
SeekIC No. : 004367852 Detail

HVM187WK: Features: · Low forward resistance. (rf = 5.5 max)· MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit ...

floor Price/Ceiling Price

Part Number:
HVM187WK
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

·  Low forward resistance. (rf = 5.5 max)
·  MPAK package is suitable for high density surface mounting and high speed assembly.



Pinout

  Connection Diagram


Specifications

Item
Symbol
Value
Unit
Reverse voltage
VR
60
V
Forward current
IF
50
mA
Power dissipation
Pd*1
100
mW
Junction temperature
Tj
125
Storage temperature
Tstg
-55 to +125



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