HVU133

Features: ` Low capacitance.(C1=1.0pF max)` Low forward resistance. (rf=0.7 max)` Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.Specifications Item Symbol Value Unit Reverse voltage VR 30 V Power dissipation P...

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HVU133 Picture
SeekIC No. : 004367905 Detail

HVU133: Features: ` Low capacitance.(C1=1.0pF max)` Low forward resistance. (rf=0.7 max)` Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.Specifications ...

floor Price/Ceiling Price

Part Number:
HVU133
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

` Low capacitance.(C1=1.0pF max)
` Low forward resistance. (rf=0.7 max)
` Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.





Specifications

Item
Symbol
Value
Unit
Reverse voltage
VR
30
V
Power dissipation
Pd
150
mW
Junction temperature
Tj
125
Storage temperature
Tstg
-55 to +125





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