HX6228

Features: RADIATION• Fabricated with RICMOS™ IV Silicon on Insulator (SOI) 0.7 m Process (Leff = 0.55 m)• Total Dose Hardness through 1x106 rad(SiO2)• Neutron Hardness through 1x1014 cm-2• Dynamic and Static Transient Upset Hardness through 1x1011 rad (Si)/s• Do...

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SeekIC No. : 004368105 Detail

HX6228: Features: RADIATION• Fabricated with RICMOS™ IV Silicon on Insulator (SOI) 0.7 m Process (Leff = 0.55 m)• Total Dose Hardness through 1x106 rad(SiO2)• Neutron Hardness throug...

floor Price/Ceiling Price

Part Number:
HX6228
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/5

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Product Details

Description



Features:

RADIATION
• Fabricated with RICMOS™ IV Silicon on Insulator (SOI) 0.7 m Process (Leff = 0.55 m)
• Total Dose Hardness through 1x106 rad(SiO2)
• Neutron Hardness through 1x1014 cm-2
• Dynamic and Static Transient Upset Hardness through 1x1011 rad (Si)/s
• Dose Rate Survivability through <1x1012 rad(Si)/s
• Soft Error Rate of <1x10-10 upsets/bit-day in Geosynchronous Orbit
• No Latchup
OTHER
• Read/Write Cycle Times
    16 ns (Typical)
    25 ns (-55 to 125°C)
• Typical Operating Power <25 mW/MHz
• Asynchronous Operation
• CMOS or TTL Compatible I/O
• Single 5 V ± 10% Power Supply
• Packaging Options
    - 32-Lead Flat Pack (0.820 in. x 0.600 in.)
    - 40-Lead Flat Pack (0.775 in. x 0.710 in.)



Specifications

Symbol
Parameter
Rating
Units
Min
Max
VDD
Supply Voltage Range (2)
-0.5
6.5
V
VPIN
Voltage on Any Pin (2)
-0.5
VDD+0.5
V
TSTORE
Storage Temperature (Zero Bias)
-65
150
TSOLDER
Soldering Temperature (5 Seconds)
270
PD
Maximum Power Power Dissipation (3)
2.5
W
IOUT
DC or Average Output Current
25
mA
VPROT
ESD Input Protection Voltage (4)
1500
V
JC
Thermal Resistance (Jct-to-Case)
2
/W
TJ
Junction Temperature
175
(1) Stresses in excess of those listed above may result in permanent damage. These are stress ratings only, and operation at these levels is not implied. Frequent or extended exposure to absolute maximum conditions may affect device reliability.
(2) Voltage referenced to VSS.
(3) RAM power dissipation (IDDSB + IDDOP) plus RAM output driver power dissipation due to external loading must not exceed this specification.
(4) Class 1 electrostatic discharge (ESD) input protection. Tested per MIL-STD-883, Method 3015 by DESC certified lab.



Description

The 128K x 8 Radiation Hardened Static RAM HX6228 is a high performance 131,072 word x 8-bit static random access memory with industry-standard functionality. It is fabricated with Honeywell's radiation hardened technology, and is designed for use in systems operating in radiation environments. The RAM HX6228 operates over the full military temperature range and requires only a single 5 V ± 10% power supply. The RAM is wire bond programmable for either TTL or CMOS compatible I/O. Power consumption is typically less than 25 mW/MHz in operation, and less than 5 mW in the low power disabled mode. The RAM read operation is fully asynchronous, with an associated typical access time of 15 ns at 5V.

Honeywell's enhancedSOI RICMOS™IV (Radiation Insensitive CMOS) technology is radiation hardened through the use of advanced and proprietary design, layout and process hardening techniques. The RICMOS™ IV process is an advanced 5-volt, SIMOX CMOS technology with a 150 Å gate oxide and a minimum feature size of 0.7 m (0.55 m effective gate length-Leff). Additional features of HX6228 include Honeywell's proprietary SHARP planarization process, and a lightly doped drain (LDD) structure for improved short channel reliability. A 7 transistor (7T) memory cell is used for superior single event upset hardening, while three layer metal power bussing and the low collection volume SIMOX substrate provide improved dose rate hardening.




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