HY39S256

Features: • Fully Synchronous to Positive Clock Edge• 0 to 70 °C Standard Operating Temperature• -40 to 85 °C Industrial Operating Temperature• Four Banks controlled by BA0 & BA1• ProgrammableCAS Latency: 2 & 3• Programmable Wrap Sequence: Sequential or ...

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SeekIC No. : 004368203 Detail

HY39S256: Features: • Fully Synchronous to Positive Clock Edge• 0 to 70 °C Standard Operating Temperature• -40 to 85 °C Industrial Operating Temperature• Four Banks controlled by BA0 &...

floor Price/Ceiling Price

Part Number:
HY39S256
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

• Fully Synchronous to Positive Clock Edge
• 0 to 70 °C Standard Operating Temperature
• -40 to 85 °C Industrial Operating Temperature
• Four Banks controlled by BA0 & BA1
• Programmable CAS Latency: 2 & 3
• Programmable Wrap Sequence: Sequential or Interleave
• Programmable Burst Length: 1, 2, 4, 8 and full page
• Multiple Burst Read with Single Write Operation
• Automatic and Controlled Precharge Command
• Data Mask for Read / Write control (x4, x8)
• Data Mask for Byte Control (x16)
• Auto Refresh (CBR) and Self Refresh
• Power Down and Clock Suspend Mode
• 8192 refresh cycles / 64 ms (7.8 s)
• Random Column Address every CLK (1-N Rule)
• Single 3.3 V ± 0.3 V Power Supply
• LVTTL Interface versions
• Packages:
   P(G)TSOPII54 (400mil width)
   PGTFBGA54



Pinout

  Connection Diagram


Specifications

Parameter Symbol Limit Values Unit Note/
Test Condition
Min. Max.
Input / Output voltage relative to VSS VIN,VOUT -1.0 +4.6 V -
Voltage on VDD supply relative to VSS VDD

-1.0

+4.6 V -
Voltage on VDDQ supply relative to VSS VDDQ

-1.0

+4.6 V -
Operating Temperature for HYB... TA 0 +70 -
Operating Temperature for HYI... TA -40 +85 -
Storage temperature range TSTG -55 +150 -
Power dissipation per SDRAM component PD - 1 W -
Data out current (short circuit) IOUT - 50 mA -
Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit.


Description

The HY39S256 are four bank Synchronous DRAMs organized as 4 banks x 16 MBit x4, 4 banks x 8 MBit x8 and 4 banks x 4 Mbit x16 respectively. These synchronous devices achieve high speed data  ransfer rates for CAS latencies by employing a chip architecture that prefetches multiple bits and then synchronizes the output data to a system clock. The chip is fabricated with Qimonda's advanced 0.11-m 256-MBit DRAM process technology. The device HY39S256 is designed to comply with all industry standards set for synchronous DRAM products, both electrically and mechanically. All of the control, address, data input and output circuits are synchronized with the positive edge of an externally supplied clock.

Operating the four memory banks in an interleave fashion allows random access operation to occur at a higher rate than is possible with standard DRAMs HY39S256. A sequential and gapless data rate is possible depending on burst length, CAS latency and speed grade of the device.

Auto Refresh (CBR) and Self Refresh operation are supported. These devices HY39S256 operate with a single 3.3 V ± 0.3 V power supply.

All 256-Mbit components are available in P(G)TSOPII54 and PGTFBGA54 packages




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