HYB3165160AT(L)-60 General Description
This device is a 64 MBit dynamic RAM organized 4 194 304 by 16 bits. The device is fabricated on an advanced second generation 64Mbit 0,35mm-CMOS silicon gate process technology. The circuit and process design allow this device to achieve high performance and low power dissipation. This DRAM operates with a single 3.3 +/-0.3V power supply and interfaces with either LVTTL or LVCMOS levels. Multiplexed address inputs permit the HYB 3164(5)160AT to be packaged in a 400 mil wide TSOP-50 package. These packages provide high system bit densities and are compatible with commonly used automatic testing and insertion equipment. The HYB3164(5/6)160ATL parts (L-version) have a very low power „sleep mode" supported by Self Refresh.
HYB3165160AT(L)-60 Maximum Ratings
Operating temperature range..............................................................................................0 to 70 °C
Storage temperature range.......................................................................................... 55 to 150 °C
Input/output voltage..................................................................................-0.5 to min (Vcc+0.5,4.6) V
Power supply voltage.....................................................................................................-0.5V to 4.6 V
Power dissipation........................................................................................................................1.3 W
Data out current (short circuit)....................................................................................................50 mA
Note
Stresses above those listed under „Absolute Maximum Ratings" may cause permanent damage of the device. Exposure to absolute maximum rating conditions for extended periods may effect device reliability.
HYB3165160AT(L)-60 Connection Diagram
HYB3165160AT(L)-60 datasheet
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