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Part Number: HYI39SC128160FE
Description: The HY[B/I]39S128[800/160]FE are four bank Synchronous DRAM's organized as 16 MBit *8 and 8 Mbit *16 r...


Description: The HY[B/I]39S128[800/160]FE are four bank Synchronous DRAM's organized as 16 MBit *8 and 8 Mbit *16 r...
The HY[B/I]39S128[800/160]FE are four bank Synchronous DRAM's organized as 16 MBit *8 and 8 Mbit *16 respectively. These synchronous devices achieve high speed data transfer rates for CAS latencies by employing a chip architecture that prefetches multiple bits and then synchronizes the output data to a system clock. The chip is fabricated with Qimonda advanced 0.11 m 128-MBit DRAM process technology.
The device is designed to comply with all industry standards set for synchronous DRAM products, both electrically and mechanically. All of the control, address, data input and output circuits are synchronized with the positive edge of an externally supplied clock.
Operating the four memory banks in an interleave fashion allows random access operation to occur at a higher rate than is possible with standard DRAMs. A sequential and gapless data rate is possible depending on burst length, CAS latency and speed grade of the device.
Auto Refresh (CBR) and Self Refresh operation are supported. These devices operate with a single 3.3 V ± 0.3 V power supply. All 128-Mbit components are available in PG TSOPII54 packages.
| Parameter | Symbol | Limit Values | Unit | Note/ Test Condition | |
| Min. | Max. | ||||
| Input / Output voltage relative to VSS | VIN,VOUT | -1.0 | +4.6 | V | - |
| Voltage on VDD supply relative to VSS | VDD |
-1.0 |
+4.6 | V | - |
| Voltage on VDDQ supply relative to VSS | VDDQ |
-1.0 |
+4.6 | V | - |
| Operating Temperature for HYB... | TA | 0 | +70 | - | |
| Operating Temperature for HYI... | TA | -40 | +85 | - | |
| Storage temperature range | TSTG | -55 | +150 | - | |
| Power dissipation per SDRAM component | PD | - | 1 | W | - |
| Data out current (short circuit) | IOUT | - | 50 | mA | - |
HYI39SC128160FE-6
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