HYM324000GD-50

SpecificationsOperating temperature range..............................................................................................0 to 70 °CStorage temperature range......................................................................................... 55 to 150 °CSoldering temperature........

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SeekIC No. : 004369207 Detail

HYM324000GD-50: SpecificationsOperating temperature range..............................................................................................0 to 70 °CStorage temperature range...............................

floor Price/Ceiling Price

Part Number:
HYM324000GD-50
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/18

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Product Details

Description



Specifications

Operating temperature range..............................................................................................0 to 70 °C
Storage temperature range......................................................................................... 55 to 150 °C
Soldering temperature.............................................................................................................260 °C
Soldering time............................................................................................................................. 10 s
Input/output voltage..................................................................................-0.5 to min (Vcc+0.5,4.6) V
Power supply voltage....................................................................................................  -0.5V to 4.6 V
Power dissipation........................................................................................................................ 1.0 W
Data out current (short circuit)....................................................................................................50 mA



Description

The HYM HYM324000GD-50 -50/-60 is a 16 MByte DRAM module organized as 4 194 304 words by 32-bit in a 72-pin, dual read-out, small outline package comprising two HYB 3165160T 4M ´ 16 DRAMs in 500 mil wide TSOPII-54 - packages mounted together with two 0.2 mF ceramic decoupling capacitors on a PC board. Each HYB 3165160T is described in the data sheet and is fully electrically tested and processed according to Siemens standard quality procedure prior to module assembly. After assembly onto the board, a further set of electrical tests is performed.

The density and speed of the module can be detected by the use of presence detect pins.

These HYM324000GD-50 modules are ideal for portable systems applications where high memory capacity is needed.




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