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IDT74FCT3827B

Features: •0.5 MICRON CMOS Technology•ESD > 2000V per MIL-STD-883, Method 3015;> 200V using machine model (C = 200pF, R = 0)•25 mil Center SSOP Packages•Extended commercial range of -40°C to +85°C•VCC= 3.3V ±0.3V, Normal Range or VCC= 2.7V to 3.6V, Extended Ran...

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SeekIC No. : 004373045 Detail

IDT74FCT3827B: Features: •0.5 MICRON CMOS Technology•ESD > 2000V per MIL-STD-883, Method 3015;> 200V using machine model (C = 200pF, R = 0)•25 mil Center SSOP Packages•Extended commer...

IDT74FCT3827B Data Sheet

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Part Number:
IDT74FCT3827B
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

•0.5 MICRON CMOS Technology
•ESD > 2000V per MIL-STD-883, Method 3015;
> 200V using machine model (C = 200pF, R = 0)
•25 mil Center SSOP Packages
•Extended commercial range of -40°C to +85°C
•VCC= 3.3V ±0.3V, Normal Range or
  VCC = 2.7V to 3.6V, Extended Range
•CMOS power levels (0.4µW typ. static)
•Rail-to-Rail output swing for increased noise margin
•Military product compliant to MIL-STD-883, Class B


Pinout

Connection Diagram


Specifications

Symbol Rating Commercial Military Unit
VTERM(2) Terminal Voltage with Respect to GND 0.5 to +4.6 0.5 to +4.6 V
VTERM(3) Terminal Voltage with Respect to GND 0.5 to +7.0 0.5 to +7.0 V
VTERM(4) Terminal Voltage with Respect to GND 0.5 to VCC + 0.5 0.5 to VCC + 0.5 V
TA Operating Temperature 40 to +85 55 to +125 °C
TBIAS Temperature Under Bias 55 to +125 65 to +135 °C
TSTG Storage Temperature 55 to +125 65 to +150 °C
PT Power Dissipation 1.0 1.0 W
IOUT DC Output Current 60 to +60 60 to +60 mA



Description

The IDT74FCT3827B 10-bit bus drivers are built using an advanced dual metal CMOS technology.  These high speed, low power buffers are ideal for high-performance bus interface buffering for wide data/address paths or buses carrying parity.The 10-bit buffers have NAND-ed output enables for maxi- mum control flexibility.

All of the IDT74FCT3827B high performance interface compo-nents are designed for high-capacitance load drive capability, while providing low-capacitance bus loading at both inputs and outputs.




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