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Part Number: IR1H40CSP

 

 

 

 

Description: True chip-scale packaging is available from International Rectifier. The IR1H40CSP surface-mount Schot...


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IR1H40CSP General Description


True chip-scale packaging is available from International Rectifier. The IR1H40CSP surface-mount Schottky rectifier has been designed for applications requiring low forward drop and very small foot prints on PC boards. Typical applications are in disk drives, switching power supplies, converters, free-wheeling diodes, battery charging, and reverse battery protection.

·Small foot print, surface mountable
·Low forward voltage drop
·High frequency operation
·Guard ring for enhanced ruggedness and long term reliability

The FlipkyTM package, is one-fifth the footprint of a comparable SMA package and has a profile of less then .8mm. Combined with the low thermal resistance of the die level device, this makes the FlipkyTM the best device for application where printed circuit board space is at a premium and in extremely thin application environments such as battery packs, cell phones and PCMCIA cards.

IR1H40CSP Maximum Ratings

Parameters Value Units Conditions
IF(AV) Max. Average Forward Current 1.0 A 50% duty cycle @ TPCB = 117 , rectangular wave form
IFSM Max. Peak One Cycle Non-Repetitive
Surge Current @ 25
250 A 5µs Sine or 3µs Rect. pulse Following any rated
load condition and
with rated VRRM applied
21 10ms Sine or 6ms Rect. pulse
EAS Non- Repetitive Avalanche Energy 10 mJ TJ = 25 , IAS = 2.0A, L = 5.0mH
IAR Repetitive Avalanche Current 2.0 A Current decaying linearly to zero in 1 µsec
Frequency limited by TJ max. Va = 1.5 x Vr typical

IR1H40CSP Features

·Ultra Low VF per Footprint Area
·Low Leakage
·Low Thermal Resistance
·One-fifth Footprint of SMA
·Super Low Profile (<.8mm)
·Available Tested on Tape & Reel

IR1H40CSP datasheet

IR1H40CSP
PDF/DataSheet Download

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