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MFG:IR  Package Cooled:TO-220  D/C:09+  

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Part Number: IRF5210

 

MFG: IR

Package Cooled: TO-220

D/C: 09+

Description: Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low&n...


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IRF5210 General Description


Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low  on-resistance per silicon area.  This benefit,combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts.  The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry.

IRF5210 Maximum Ratings

  Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ -10V -40 A
ID @ TC = 100°C Continuous Drain Current, VGS @ -10V -29
IDM Pulsed Drain Current -140
PD @TC = 25°C Power Dissipation 200 W
  Linear Derating Factor 1.3 W/°C
VGS Gate-to-Source Voltage ± 20 V
EAS Single Pulse Avalanche Energy 780 mJ
IAR Avalanche Current -21 A
EAR Repetitive Avalanche Energy 20 mJ
dv/dt Peak Diode Recovery dv/dt -5.0 V/ns
T J
TSTG
Operating Junction and
Storage Temperature Range
-55 to + 175 °C
  Soldering Temperature, for 10 seconds 300 (1.6mm from case )
  Mounting torque, 6-32 or M3 screw 10 lbf*in (1.1N*m)  

IRF5210 Features

·Advanced Process Technology
·Ultra Low On-Resistance
·Dynamic dv/dt Rating
· 175°C Operating Temperature
·Fast Switching
· P-Channel
·Fully Avalanche Rated

IRF5210 datasheet

IRF5210
PDF/DataSheet Download

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