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MFG:N/A  Package Cooled:NA/  D/C:09+  

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Part Number: IRF5210L

 

MFG: N/A

Package Cooled: NA/

D/C: 09+

Description: Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low o...


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IRF5210L General Description


Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area.  This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2 Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest  power capability and the lowest possible on-resistance in any existing surface mount package. The D2 Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

The through-hole version (IRF5210L) is available for low-profile applications.

IRF5210L Maximum Ratings

Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ -10V -40 A
ID @ TC = 100°C Continuous Drain Current, VGS @ -10V -29
IDM Pulsed Drain Current -140
PD @TC = 25°C Power Dissipation 3.8 W
 PD @TC = 25°C  Power Dissipation  200  
Linear Derating Factor 1.3 W/°C
VGS Gate-to-Source Voltage ± 20 V
EAS Single Pulse Avalanche Energy 780 mJ
IAR Avalanche Current -21 A
EAR Repetitive Avalanche Energy 20 mJ
dv/dt Peak Diode Recovery dv/dt -5.0 V/ns
T J
TSTG
Operating Junction and
Storage Temperature Range
-55 to + 175 °C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )

IRF5210L Features

·Advanced Process Technology
·Surface Mount (IRF5210S)
· Low-profile through-hole (IRF5210L)
· 175°C Operating Temperature
· Fast Switching
·P-Channel
· Fully Avalanche Rated

IRF5210L datasheet

IRF5210L
PDF/DataSheet Download

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