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Part Number: IRF630NLPbF

 

 

 

 

Description: Fifth Generation HEXFET® Power MOSFETs from International Rectifier utilize advanced pr...


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IRF630NLPbF General Description


Fifth Generation HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry.

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.
 
The through-hole version (IRF630NL) is available for lowprofile application.

IRF630NLPbF Maximum Ratings

  Parameter
Max.
Units
ID @ TC = 25 Continuous Drain Current,VGS @ 10V
9.3
A
ID @ TC = 100 Continuous Drain Current,VGS @ 10V
6.5
IDM Pulsed Drain Current
37
PD @ TC = 25 Power Dissipation
82
W
  Linear Derating Factor
0.5
W/
VGS Gate-to-Source Voltage
±20
V
EAS Single Pulse Avalanche Energy
94
mJ
IAR Avalanche Current
9.3
A
EAR Repetitive Avalanche Energy
8.2
mJ
dv/dt Peak Diode Recovery dv/dt
8.1
V/ns
TJ
TSTG
Operating Junction and
Storage Temperature Range
-55 to 175
  Soldering Temperature, for 10 seconds
300(1.6mm from case )
  Mounting torque, 6-32 or M3 srew  10 lbf`in (1.1N`m)  
Notes:
Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25, L = 6.5mH RG = 25, IAS = 5.4A.
ISD 5.4A,di/dt280A/µs, VDDV(BR)DSS, TJ 175.
This is only applied to TO-220AB package.

IRF630NLPbF Features

` Advanced Process Technology
` Dynamic dv/dt Rating
` 175Operating Temperature
` Fast Switching
` Fully Avalanche Rated
` Ease of Paralleling
` Simple Drive Requirements
` Lead-Free

IRF630NLPbF datasheet

IRF034
PDF/DataSheet Download

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IRF630NLPbF Relative Products

  • IRF630NL

    IRF630NL

    Fifth Generation HEXFET® Power MOSFETs IRF630NL from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design...

  • IRF630N

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    Fifth Generation HEXFET® Power MOSFETs IRF630N from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design ...

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    This power MOSFET IRF630MFPis designed using the company's consolidated strip layout-based MESH OVERLAY ™ process. This technology matches and improves the performances compared with standard parts from various sources.Isolated TO-220 option simplifies...

  • IRF630M

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    This power MOSFET IRF630Mis designed using the company's consolidated strip layout-based MESH OVERLAY ™ process. This technology matches and improves the performances compared with standard parts from various sources.Isolated TO-220 option simplifies a...

  • IRF630FP

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    This power MOSFET IRF630FPis designed using he company's consolidated strip layout-based MESH OVERLAY™ process. This technology matches and improves the performances compared with standard parts from various sources.

  • IRF630F

    IRF630F

    `With TO-220F package IRF630F`Low on-stateand thermal resistance`Fast switching`VDSS=200V; RDS(ON)0.4;ID=9A`1.gate 2.drain 3.source

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