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MFG:IOR  Package Cooled:T0223  

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Part Number: IRFL024N

 

MFG: IOR

Package Cooled: T0223

 

Description: Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achiev...


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IRFL024N General Description


Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The SOT-223 package is designed for surface-mount using vapor phase, infra red, or wave soldering techniques. Its unique package design allows for easy automatic pickand- place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking. Power dissipation of 1.0W is possible in a typical surface mount application.

IRFL024N Maximum Ratings

  Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V** 4.0 A
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V* 2.8 A
ID @ TC = 70°C Continuous Drain Current, VGS @ 10V* 2.3 A
IDM Pulsed Drain Current 11.2 A
PD @TC = 25°C Power Dissipation(PCB Mount)** 2.1 W
PD @TC = 25°C Power Dissipation(PCB Mount)* 1.0 W
  Linear Derating Factor(PCB Mount)* 8.3 W/°C
VGS Gate-to-Source Voltage ± 20 V
EAS Single Pulse Avalanche Energy 214 mJ
IAR Avalanche Current 2.8
A
EAR Repetitive Avalanche Energy * 0.1 mJ
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
TJ Operating Junction and -55 to + 150 °C
TSTG Storage Temperature Range -55 to + 150 °C

IRFL024N Features

· Surface Mount
· Advanced Process Technology
· Ultra Low On-Resistance
· Dynamic dv/dt Rating
· Fast Switching
·Fully Avalanche Rated

IRFL024N datasheet

IRFL024N
PDF/DataSheet Download

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