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MFG:IOR  Package Cooled:TO223  

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Part Number: IRFL4310

 

MFG: IOR

Package Cooled: TO223

 

Description: Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achiev...


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IRFL4310 General Description


Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low  on-resistance per silicon area.  This benefit,combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The SOT-223 package is designed for surface-mount using vapor phase, infra red, or wave soldering techniques. Its unique package design allows for easy automatic pick-and-place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking.  Power dissipation of 1.0W is possible in a typical surface mount application.

IRFL4310 Maximum Ratings

Parameter

Max.
Units
ID @ TA = 25°C
Continuous Drain Current, VGS @ 10V**
2.2
A
ID @ TA = 25°C
Continuous Drain Current, VGS @ 10V*
1.6
ID @ TA = 70°C
Continuous Drain Current, VGS @ 10V*
1.3
IDM
Pulsed Drain Current 
13
PD @TA = 25°C
Power Dissipation (PCB Mount)**
2.1
W
PD @TA = 25°C
Power Dissipation (PCB Mount)*
1.0
W
Linear Derating Factor (PCB Mount)*
8.3
mW/°C
VGS
Gate-to-Source Voltage
± 20
V
EAS
Single Pulse Avalanche Energy‚
47
mJ
IAR
Avalanche Current
1.6
A
EAR
Repetitive Avalanche Energy*
0.10
mJ
dv/dt
Peak Diode Recovery dv/dt ƒ
5.0
V/ns
TJ, TSTG
Junction and Storage Temperature Range
55 to + 150
°C

IRFL4310 datasheet

IRFL4310
PDF/DataSheet Download

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