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Part Number: IRFP140

 

 

 

 

 

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IRFP140 Maximum Ratings

IRFP140 UNITS
Drain to Source Voltage (Note 1) VDS 100 V
Drain to Gate Voltage (RGS = 20k) (Note 1) VDGR 100 V
Continuous Drain Current ID 31 A
TC = 100 ID 22 A
Pulsed Drain Current (Note 3) IDM 120 A
Gate to Source Voltage VGS ±20 V
Maximum Power Dissipation PD 180 W
Linear Derating Factor 1.2 W/
Single Pulse Avalanche Energy Rating (Note 4) EAS 100 mJ
Operating and Storage Temperature TJ, TSTG -55 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s TL 300
Package Body for 10s, See Techbrief 334 Tpkg 260
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25to150.

IRFP140 Features

• 31A, 100V
• rDS(ON) = 0.077
• Single Pulse Avalanche Energy Rated
• SOA is Power Dissipation Limited
• Nanosecond Switching Speeds
• Linear Transfer Characteristics
• High Input Impedance
• Related Literature
- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"

IRFP140 datasheet

IRFP140
PDF/DataSheet Download

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