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MFG:IR Package Cooled:N/A D/C:08+

MFG:IR Package Cooled:N/A D/C:08+

| Symbol | Parameter | Max. | Units |
| ID @ TC = 25 | Continuous Drain Current, VGS @ 10V (Silicon Limited) | 350 | A |
| ID @ TC= 100 | Continuous Drain Current, VGS @ 10V (Silicon Limited) | 250 | |
| ID @ TC = 25 | Continuous Drain Current, VGS @ 10V (Wire Bond Limited) | 195 | |
| IDM | Pulsed Drain Current | 1390 | |
| PD @TC = 25 | Maximum Power Dissipation | 380 | W |
| Linear Derating Factor | 2.5 | W/ | |
| VGS | Gate-to-Source Voltage | ± 20 | V |
| dv/dt | Peak Diode Recovery |
2.0 | V/ns |
| TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 175 | |
| Soldering Temperature, for 10 seconds(1.6mm from case) | 300 | ||
| Mounting torque, 6-32 or M3 screw | 10lb in (1.1N m) |
IRF034
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