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Part Number: IRFP450
Description: This power MOSFET is designed using the company's consolidated strip layout-based MESH OVERLAY] proces...


Description: This power MOSFET is designed using the company's consolidated strip layout-based MESH OVERLAY] proces...
This power MOSFET is designed using the company's consolidated strip layout-based MESH OVERLAY] process. This technology matches and improves the performances compared with standard parts from various sources.
|
Symbol |
Parameter |
Value |
Uni t |
|
VDS |
Drain-source Voltage (VGS = 0) |
500 |
V |
|
VDGR |
Drain- gate Voltage (RGS = 20 k) |
500 |
V |
|
VGS |
Gate-source Voltage |
± 20 |
V |
|
ID |
Drain Current (continuous) at Tc = 25 °C |
14 |
A |
|
ID |
Drain Current (continuous) at Tc = 100 °C |
8.7 |
A |
|
IDM(•) |
Drain Current (pulsed) |
56 |
A |
|
Ptot |
Total Dissipation at Tc = 25 oC |
190 |
W |
| Derating Factor |
1.5 |
W/°C | |
|
dv/dt(1) |
Peak Diode Recovery voltage slope |
3.5 |
V/ns |
|
Tstg |
Storage Temperature |
-65 to 150 |
°C |
|
Tj |
Max. Operating Junction Temperature |
150 |
°C |
(•) Pulse width limited by safe operating area (1) ISD 14 A, di/dt 130 A/s, VDD V(BR)DSS, Tj TJMAX
` TYPICAL RDS(on) = 0.33
` EXTREMELY HIGH dv/dt CAPABILITY
` 100% AVALANCHE TESTED
` VERYLOW INTRINSIC CAPACITANCES
` n GATECHARGE MINIMIZED
· HIGH CURRENT SWITCHING
· UNINTERRUPTIBLE POWER SUPPLY (UPS)
· DC/DC COVERTERS FOR TELECOM, INDUSTRIAL, AND LIGHTING EQUIPMENT.
IRFP450
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