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IRFU120N

Features: ·Surface Mount (IRFR120N)·Straight Lead (IRFU120N)·Advanced Process Technology·Fast Switching·Fully Avalanche RatedSpecifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 9.4 A ID @ TC = 100°C Continuous Drain Current, VGS @ 10V...

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SeekIC No. : 004377472 Detail

IRFU120N: Features: ·Surface Mount (IRFR120N)·Straight Lead (IRFU120N)·Advanced Process Technology·Fast Switching·Fully Avalanche RatedSpecifications Parameter Max. Units ID @ TC = 25°C Con...

IRFU120N Data Sheet

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Part Number:
IRFU120N
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

·Surface Mount (IRFR120N)
·Straight Lead (IRFU120N)
·Advanced Process Technology
·Fast Switching
·Fully Avalanche Rated


Specifications

 
Parameter
Max.
Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V
9.4
A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V
6.6
IDM Pulsed Drain Current
38
PD @TC = 25°C Power Dissipation
48
W
  Linear Derating Factor
0.32
W/°C
VGS Gate-to-Source Voltage
±20
V
EAS Single Pulse Avalanche Energy
91
mJ
IAR Avalanche Current
5.7
A
EAR Repetitive Avalanche Energy
5.7
mJ
dv/dt Peak Diode Recovery dv/dt
4.8
V/ns
TJ
TSTG		 Operating Junction and
Storage Temperature Range
-55to+175
°C
  Soldering Temperature, for 10 seconds
300(1.6mm from case )
Thermal Resistance
 
Parameter
Typ.
Max.
Units
RJC Junction-to-Case
-
3.1
°C/W
RJA Junction-to-Ambient (PCB mount) **
-
50
RJA Junction-to-Ambient
-
110



Description

Fifth Generation HEXFETs IRFU120N from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.

The D-PAK of IRFU120N is designed for surface mounting using vapor phase, infrared, or wave soldering techniques.The straight lead version (IRFU series) is for throughhole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.




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