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IRFU3504

Features: Advanced Process Technology Ultra Low On-Resistance 175°C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to TjmaxSpecifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited) 87 A ID @ TC = 100°C Con...

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IRFU3504: Features: Advanced Process Technology Ultra Low On-Resistance 175°C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to TjmaxSpecifications Parameter Max. Units ...

IRFU3504 Data Sheet

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Part Number:
IRFU3504
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax


Specifications

Parameter

Max.

Units

ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited) 87 A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V (See Fig.9) 61
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Package Limited)

30

IDM Pulsed Drain Current 350
PD @TC = 25°C Power Dissipation 140 W
Linear Derating Factor 0.92 W/°C
VGS Gate-to-Source Voltage ±20 V
EAS Single Pulse Avalanche Energy 240 mJ
EAS (Tested ) Single Pulse Avalanche Energy Tested Value

480

IAR Avalanche Current See Fig.12a, 12b, 15, 16 A
EAR Repetitive Avalanche Energy mJ
TJ
TSTG		 Operating Junction and
Storage Temperature Range		 -55 to + 175
Soldering Temperature, for 10 seconds 300 (1.6mm from case)



Description

Specifically designed for Automotive applications, this HEXFET® Power MOSFET of IRFU3504 utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this product are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating. These features of IRFU3504 combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.

The D-Pak of IRFU3504 is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.




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