Features: Advanced Process Technology Ultra Low On-Resistance 175°C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to TjmaxSpecifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V(Silicon limited) 71 A ID @ TC = 100°C...
IRFU3505: Features: Advanced Process Technology Ultra Low On-Resistance 175°C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to TjmaxSpecifications Parameter Max. Units ...
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Parameter |
Max. |
Units | |
ID @ TC = 25°C | Continuous Drain Current, VGS @ 10V(Silicon limited) |
71 |
A |
ID @ TC = 100°C | Continuous Drain Current, VGS @ 10V(See Fig.9) |
49 | |
ID @ TC = 25°C | Continuous Drain Current, VGS @ 10V (Package Limited) |
30 | |
IDM | Pulsed Drain Current |
280 | |
PD @TC = 25°C | Power Dissipation |
140 |
W |
Linear Derating Factor |
0.92 |
W/°C | |
VGS | Gate-to-Source Voltage |
± 20 |
V |
EAS | Single Pulse Avalanche Energy |
210 |
mJ |
EAS (Tested ) | Single Pulse Avalanche Energy Tested Value |
410 | |
IAR | Avalanche Current |
See Fig.12a, 12b, 15, 16 |
A |
EAR | Repetitive Avalanche Energy |
mJ | |
dv/dt | Peak Diode Recovery dv/dt |
40 |
V/ns |
TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 175 |
°C |
Soldering Temperature, for 10 seconds |
300 (1.6mm from case ) |
Specifically designed for Automotive applications, this HEXFET® Power MOSFET IRFU3505 utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this product are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.
The D-Pak of IRFU3505 is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.