IRFZ24LPbF

Specifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 17 A ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 12 IDM Pulsed Drain Current 68 PD @TC = 25°C Power Dissipation 3.8 W PD @TC = 25°C Power Dissipation 45 W Linear...

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SeekIC No. : 004377603 Detail

IRFZ24LPbF: Specifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 17 A ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 12 IDM Pulsed Drain Current 6...

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Part Number:
IRFZ24LPbF
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Specifications

  Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 17 A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 12
IDM Pulsed Drain Current 68
PD @TC = 25°C Power Dissipation 3.8 W
PD @TC = 25°C Power Dissipation 45 W
  Linear Derating Factor 0.30 W/°C
VGS Gate-to-Source Voltage ±20 V
EAS Single Pulse Avalance Energy 71 mJ
IAR Avalance Current 10 A
EAR Repetitive Avalanche Energy 4.5 mJ
dv/dt Peak Diode Recovery dv/dt 6.8 V/ns
TJ
Tstg
Operating Junction and
Storage Temperature Range
-55 to +175 °C
  Soldering Temperature, for 10 seconds 300 (1.6mm from case )



Description

Fifth Generation HEXFETs from International Rectifier IRFZ24LPbF utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device IRFZ24LPbF design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2Pak IRFZ24LPbF is a surface mount power package capable of accommodating die sizes up to HEX-4. The IRFZ24LPbF provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak IRFZ24LPbF is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRFZ24LPbF) is available for lowprofile applications.




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