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IRFZ44S/L

Specifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 50 A ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 36 IDM Pulsed Drain Current 200 PD @TA = 25°C Power Dissipation 3.7 W PD @TC = 25°C Power Dissipation 150 W Li...

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IRFZ44S/L: Specifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 50 A ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 36 IDM Pulsed Drain Current ...

IRFZ44S/L Data Sheet

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Part Number:
IRFZ44S/L
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Description



Specifications

  Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 50 A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 36
IDM Pulsed Drain Current 200
PD @TA = 25°C Power Dissipation 3.7 W
PD @TC = 25°C Power Dissipation 150 W
  Linear Derating Factor 1.0 W/°C
VGS Gate-to-Source Voltage ± 20 V
EAS Single Pulse Avalanche Energy 100 mJ
dv/dt Peak Diode Recovery dv/dt 4.5 V/ns
TJ
TSTG		 Operating Junction and
Storage Temperature Range		 -55 to + 175
°C
  Soldering Temperature, for 10 seconds 300 (1.6mm from case )  



Description

Third Generation HEXFETs from International Rectifier IRFZ44S/L utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device IRFZ44S/L design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2Pak IRFZ44S/L is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak IRFZ44S/L is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

The through-hole version (IRFZ44S/L) is available for lowprofile applications.




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