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Part Number: IRFZ48VSPbF

 

 

 

 

Description: Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques...


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IRFZ48VSPbF General Description


Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

IRFZ48VSPbF Maximum Ratings

Parameter Symbol Rating Unit
Continuous Drain Current, VGS @ 10V,Tc = 25 ID 72 A
Continuous Drain Current, VGS @ 10V,Tc = 100 ID 51 A
Pulsed Drain Current*1 IDM 290 A
Power Dissipation Tc = 25 PD 150 W
Linear Derating Factor   1.0 /W
Gate-to-Source Voltage VGS ±20 V
Single Pulse Avalanche Energy EAS 166 mJ
Avalanche Current *1 IAR 72 A
Repetitive Avalanche Energy EAR 15 mJ
Peak Diode Recovery dv/dt *2 dv/dt 5.3 V/ns
Operating Junction and Storage Temperature Range TJ,TSTG -55 to + 175
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Mounting torque, 6-32 or M3 srew 10 lbf.in (1.1N.m)  

IRFZ48VSPbF Features

· Advanced Process Technology
· Ultra Low On-Resistance
· Dynamic dv/dt Rating
· 175°C Operating Temperature
· Fast Switching
· Fully Avalanche Rated
· Optimized for SMPS Applications
· Lead-Free

IRFZ48VSPbF datasheet

IRF034
PDF/DataSheet Download

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