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MFG:TO-220AB  Package Cooled:7850  D/C:IR  

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Part Number: IRFZ48Z

 

MFG: TO-220AB

Package Cooled: 7850

D/C: IR

Description: Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes t...


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IRFZ48Z General Description


Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating . These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.

IRFZ48Z Maximum Ratings

  Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V(Silicon Limited) 61 A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V(See Fig. 9) 43
IDM Pulsed Drain Current 240
PD @TC = 25°C Maximum Power Dissipation 91 W
  Linear Derating Factor 0.61 W/°C
VGS Gate-to-Source Voltage ±20 V
EAS Single Pulse Avalanche Energy (Thermally Limited) 73 mJ
EAS (tested) Single Pulse Avalanche Energy Tested Value 120
IAR Avalance Current See Fig.12a,12b,15,16 A
EAR Repetitive Avalanche Energy mJ
TJ
Tstg
Operating Junction and
Storage Temperature Range
-55 to + 175 °C
  Soldering Temperature, for 10 seconds 300 (1.6mm from case )
  Mounting torque, 6-32 or M3 srew 10 lbf•in (1.1N•m)  

IRFZ48Z Features

Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax

IRFZ48Z datasheet

IRFZ48Z
PDF/DataSheet Download

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