Features: • 6-pin SIP type full molded package, optimum IC for low-height SMPS, distance between high and low voltage pins is 1.8 mm with pin elimination.• Oscillator is provided on the monolithic control with adopting On-Chip Trimming Technology• Small temperature characteristic...
IRIS-W6756: Features: • 6-pin SIP type full molded package, optimum IC for low-height SMPS, distance between high and low voltage pins is 1.8 mm with pin elimination.• Oscillator is provided on the ...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
| Symbol | Definition | Terminal s |
Max. Ratings |
Units | Note |
| IDpeak | Drain Current * 1 | 1 - 3 | 15 | A | Single Pulse |
| IDMAX | Maximum switching current *2 | 1 - 3 | 15 | A | Ta=-20~+125 |
| EAS | Single pulse avalanche energy *3 | 1 - 3 | 400 | mJ | Single Pulse |
| VDD=99V,L=20mH | |||||
| ILpeak =6.05A | |||||
| Vcc | Input voltage for control part | 4 - 3 | 35 | V | |
| VSSOLP | SS/OLP pin voltage | 5 - 3 | -0.5 ~ 6.0 | V | |
| IFB | FB pin inflow current | 6- 3 | 10 | mA | |
| VFB | FB pin voltage | 6- 3 | -0.5 ~ 9.0 | V | within the limits of IFB |
| VOCPBD | O.C.P/F.B pin voltage | 7- 3 | -1.5 ~ 5.0 | V | |
| PD1 | Power dissipation of MOSFET *4 | 1 - 3 | 29 | W | With infinite heatsink |
| 1.3 | Without heatsink | ||||
| PD2 | Power dissipation for control part (MIC) |
4 - 3 | 0.8 | W | Specified by Vcc x Icc |
| TF | Internal frame temperature in operation | - | -20 ~ +115 | Refer to recommended operating temperature | |
| Top | Operating ambient temperature | - | -20 ~ +115 | ||
| Tstg | Storage temperature | - | -40 ~ +125 | ||
| Tch | Channel temperature | - | 150 |
IRIS-W6756 is a hybrid IC consisting of a power MOSFET and a controller IC, designed for Quasi-Resonant (including low frequency PWM) fly-back converter type SMPS (Switching Mode Power Supply) applications. This IRIS-W6756 realizes high efficiency, low noise, downsizing and standardizing of a power supply system reducing external component count and simplifying the circuit design.