IRK.56

Features: ·High Voltage·Industrial Standard Package·Thick Al metal die and double stick bonding·Thick copper baseplate·UL E78996 approved·3500VRMS isolating voltageDescriptionThe Generation V of Add-A-pak module IRK.56 combine the excellent thermal performance obtained by the usage of Direct Bonde...

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SeekIC No. : 004378229 Detail

IRK.56: Features: ·High Voltage·Industrial Standard Package·Thick Al metal die and double stick bonding·Thick copper baseplate·UL E78996 approved·3500VRMS isolating voltageDescriptionThe Generation V of Add...

floor Price/Ceiling Price

Part Number:
IRK.56
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/3/27

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Product Details

Description



Features:

·High Voltage
·Industrial Standard Package
·Thick Al metal die and double stick bonding
·Thick copper baseplate
·UL E78996 approved
·3500VRMS isolating voltage



Description

The Generation V of Add-A-pak module IRK.56 combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.  The Cu baseplate IRK.56 allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread.

The Generation V of AAP module IRK.56 is manufactured without hard mold, eliminating in this way any possible direct stress on the leads.

The electrical terminals are secured against axial pull-out: they are fixed to the module housing via a click-stop feature already tested and proved as reliable on other IR modules.

These modules IRK.56 are intended for general purpose high voltage applications such as high voltage regulated power supplies, lighting circuits, temperature and motor speed ontrol circuits, UPS and battery charger.




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