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IRK.91 SERIES

Features: High VoltageIndustrial Standard PackageThick Al metal die and double stick bondingThick copper baseplateUL E78996 approved3500VRMS isolating voltageSpecifications Parameters IRK.91 Units IF(AV) 100 A @ TC 100 °C I F(RMS) 157 A I FSM @ 50Hz ...

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IRK.91 SERIES: Features: High VoltageIndustrial Standard PackageThick Al metal die and double stick bondingThick copper baseplateUL E78996 approved3500VRMS isolating voltageSpecifications Parameters IRK.9...

IRK.91 SERIES Data Sheet

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Part Number:
IRK.91 SERIES
Supply Ability:
5000

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  • 1~5000
  • Unit Price
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  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

High Voltage
Industrial Standard Package
Thick Al metal die and double stick bonding
Thick copper baseplate
UL E78996 approved
3500VRMS  isolating voltage



Specifications

Parameters

IRK.91

Units

IF(AV)

100

A

                             @ TC

100

°C

I F(RMS)

157

A

I FSM                     @ 50Hz

2020

A

                             @ 60Hz

2110

A

I2 t                        @ 50Hz

20.43

KA2 s

                             @ 60Hz

18.65

KA2 s

I2 t

204.3

KA2 s

VRRM range

400 to 1600

V

T J

- 40 to 150

oC

TSTG

- 40 to150

oC




Description

The Generation V of Add-A-pak module IRK.91 SERIES  combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread.

The Generation V of AAP module IRK.91 SERIES  is manufactured without hard mold, eliminating in this way any possible direct stress on the leads.

The electrical terminals IRK.91 SERIES  are secured against axial pull-out: they are fixed to the module housing via a click-stop feature already tested and proved as reliable on other IR modules.




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